Hi all, I have a question regarding the solderability requirement for tape & reel components (mainly chip components) in a tin-lead process. I know that you can help me. J-STD-001 says that components to be soldered shall meet the solderability requirements of J-STD-002. Till now, we are not performing a solderability test at incoming for every lot of reels of components received. Fortunately, we do not have found significant problems due to this topic. Of course we do it when we want to check a specific lot of components. Because pretinning is not an option, I’d like to know if not to do a solderability test of 100% of lots received is considered as a non-compliance of the J-STD- 001 requirements or it may be a risk. Thank you so much for your comments, Juan --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------