Hello all, We've just achieved a critical process analysis on a PCBa for high end market. We found that the land of some of the plated through hole appeared slightly lifted from the PCB surface. The component was hand soldered with lead free alloy (SAC305). Is pad lifting is acceptable? Or to what extend does it still acceptable? I could post a picture, but I have to admit that I didn't know where or how? Cedric ORAIN Technical Director www.inovelec-groupe.com ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------