Thank you Inge, very intresting. KennyB -----Original Message----- From: Inge [mailto:[log in to unmask]] Sent: Tuesday, May 04, 2010 3:27 PM To: Ken Bloomquist; [log in to unmask] Subject: Re: [TN] Why not Pb-free? I send the paper to you, better read it yourself. But it's "historical" from 2005 Inge -------------------------------------------------- From: "Ken Bloomquist" <[log in to unmask]> Sent: den 4 May 2010 22:54 To: <[log in to unmask]> Subject: Re: [TN] Why not Pb-free? > Inge, > > By your statement (maybe their statement) "... few solder joint > reliability > problems when mixing SnPb and LF components and solder alloys." > > Doesn't that imply that that they are mixing lead into the solder joint in > one way or another, "mixing SnPb and LF". I would think that any amount of > lead added would help. > > KennyB > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge > Sent: Tuesday, May 04, 2010 1:36 PM > To: [log in to unmask] > Subject: Re: [TN] Why not Pb-free? > > You reminded me of a report from NPL-2005. In cooperation with Aeroflex, > Alcatel, BAE, Bosch, Goodrich, RR, TRW and some more. A very advanced > investigation with lots of solders with Pb and without Pb. The titel was: > Measuring the Reliability of Electronics Assemblies during the Transation > Period to Lead free Soldering. The foreword had this content: > "The work has indicated that there should be few solder joint reliability > problems when mixing SnPb and LF components and solder alloys. Very few > thermal cycling fatigue failures were experienced. Not one single failure > was generated during the harsh vibration testing ". > > I can't scan all these pages, however, if someone, not to many, are > interested, I can send it offline. You can probably get it from NPL > directly yourself. > > Very optimistic result at that time. Just wonder how they feel today. > Anyone from NPL? > > Inge > > > > ______________________________________________________________________ > This email has been scanned by the MessageLabs Email Security System. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------