Frank:
Please refer to
IPC-A-610D Item 10.5.1.2. (Solder resist coating-----Voids and
blisters)
John
From: TGAsia [mailto:[log in to unmask]]
On Behalf Of Frank
Xiong
Sent:
2010年4月7日 15:27
To: [log in to unmask]
Subject: Re: [TGAsia] Bladder (bubble) on
the solder mask after reflow
Hi
All:
Is there
any standard / criteria for the bladder of the solder mask after reflow.
Those bladder is small and happened after reflow process and it is not broken
and without copper exposure. This will not affect
the product function.
Are
there any experice for reference? Thanks !!
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