从你的描述上，不了解确切的现象。

如果是VIA出现此类问题（爆孔），可以看一下孔壁粗糙度是否太大。

Best Regards!
朱海鸥(Higher Zhu)
Hangzhou H3C Technologies Co.,Ltd.
R&D Department
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发件人: TGAsia [mailto:[log in to unmask]] 代表石红霞
发送时间: 2010年4月14日 14:35
收件人: [log in to unmask]
主题: Re: [TGAsia] Bladder (bubble) on the solder mask after reflow

各位前辈：

我现在遇到一个问题请教一下各位，希望赐教：

SMT回流焊后的PCB基板在过波峰焊时出现针孔与空洞现象，会是什么原因导致的？

南京夏普石红霞

13705179326

----- Original Message -----

From: [log in to unmask]">John Qian

To: [log in to unmask]">[log in to unmask]

Sent: Wednesday, April 07, 2010 3:41 PM

Subject: Re: [TGAsia] Bladder (bubble) on the solder mask after reflow

Frank:

Please refer to IPC-A-610D Item 10.5.1.2. (Solder resist coating-----Voids and blisters)

John

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Frank Xiong
Sent: 2010年4月7日 15:27
To: [log in to unmask]
Subject: Re: [TGAsia] Bladder (bubble) on the solder mask after reflow

Hi All:

Is there any standard / criteria for the bladder of the solder mask after reflow. Those bladder is small and happened after reflow process and it is not broken and without copper exposure. This will not affect the product function.

Are there any experice for reference? Thanks !!

Best regards

Frank April.07,2010