Hi Roger! One of the issues with solder creep data is that you need to understand as completely as possible the conditions of the testing that generated the data. There is lots of solder creep data in the public domain but you need to use it cautiously. One source of solder mechanical property data that I have found useful in the "Solder Alloy Data" , International Tin Research Institute Publication #656. The test protocol for that data set is reasonably documented and reviewable. Good Luck. Dave Hillman Rockwell Collins [log in to unmask] Roger Mack <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 04/14/2010 09:23 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to [log in to unmask] To [log in to unmask] cc Subject [TN] solder creep charts Does anyone have a detailed solder creep graph (shear stress N/mm˛ vs. time to rupture) for tin lead solder? I have been using Figure 4.35 from Klein Wassink's Soldering in Electronics. This graph starts at a shear stress of 1. We have run a ProE computer model that shows a shear stress value of 0.6N/mm˛ on the connector pins of two boards that are mounted together. We have placed some samples to bake at the maximum service condition temperature to validate the computer model is realistic. It does not take much of an extrapolation error on a small text book graph to be off by an order of magnitude. Roger Mack P.Eng. Manufacturing Specialist Parker Hannifin Electronic Controls Electronic Controls Division 1305 Clarence Avenue Winnipeg, MB R3T 1T4 Canada direct 204 453 3339 x373 [log in to unmask] www.parker.com/ecd PLEASE NOTE: The preceding information may be confidential or privileged. It only should be used or disseminated for the purpose of conducting business with Parker. If you are not an intended recipient, please notify the sender by replying to this message and then delete the information from your system. Thank you for your cooperation. ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------