Hi Lewis and Eddie,
The hot air temperature mentioned
in 7711/21 is recommended, you may adjust it if necessary. Many conditions affect
the temperature, such as PCB thickness, thermal pad effective, multi-layers, component
size… You may check out the temperature of component and solder joint and adjust
the temperature, and then soldering/rework it as proper. Anyway, as low as well.
B/R
Leo Yang
IPC Training Dept.
Tel: 021-54973435-616
M/P: 013013774245
Fax: 021-54973437
www.ipc.org/www.ipc.org.cn
发件人: TGAsia [mailto:[log in to unmask]] 代表 Eddie Yuan
发送时间:
收件人: Listserv TGAsia
主题: Re: [TGAsia] [RMX:##] [TGAsia] measure the hot air
temperature method
I think you can use a thomermal couple to verify
the actual temperature.
Hot air temp
Thanks and best regards
Eddie
Lewis Liu
<[log in to unmask]> 03/02/2010 12:03 PM
|
|
Hi,All:
In IPC 7721 and 7711
document just mentioned the hot air temperature is approximately
Do you have the
relative solutions?
Thanks,
Lewis Liu (刘定豪)
Engineering
Department
Failure Analysis
laboratory Supervisor
Tel:+86 -25- 52728710
Cell:+86 -25
-13851527451
Mail: [log in to unmask]
Kimball Electronics
(
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________