HI all, I'm only getting here once or twice a week at present, but was tipped off by a colleague about this thread this morning. I try and summarise where we are: RNT is now part of Indium Corporation with the technology and key people in Utica. The product has already made an impact in some designated areas such as bonding target base plates. How 'big' an impact you can gauge for yourselves http://www.rntfoil.com/site/applications/sputter-target-bonding/generation-1 0-sputtering-target In our part of industry a number of slightly less dramatic applications are well advanced/in production which benefit from the key fact that you don't have to heat the assembly to heat the joint. Polymer LEDs is a great example. If you have watched the video you will already have realised that die attach heat sink attach and so on are also prime. So far as SMT is concerned we are working with development partners and I have to say seeing a pick and place machine [no printer no oven] turning out an SMT like assembly is both fascinating.... and well... fascinating. This was at prototype stage a few months ago. Note the words 'SMT like' before you start planning to free up floor space :) One of the minor problems with this technology is that it is too interesting. I am not sales/marketing so do not determine policy direction. But I would say whereas we are always happy to hear from people, we are especially happy to hear from people who want to work on a case or project basis AND where the technology brings a benefit. It is only affordable if that's the case. Being "cool" won't get past anyone's bean counters! We are continuingly developing process knowledge and data and have good (strong) reliability numbers for certain applications. We also are building knowledge of what will and won't work (including some counter intuitive in both directions). Regards Mike Mike Fenner, Technical Manager Indium Corporation Europe -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick Sent: Thursday, March 04, 2010 9:14 PM To: [log in to unmask] Subject: Re: [TN] [LF] Soldering with Nanofoils Bev, Yes, I was hoping that Mike Fenner may have some input. Seems like it could be relatively easily deposited on the back of power mosfet wafers prior to dicing, etc. Could be deposited on heatsinks and heat spreaders of various composition and shape and size. It would be a waste of nanofoil, but one could laminate/bond it to the foil used to form the RF shields. Curious if you could make window frame performs from the nanofoil - if they would have enough robustness to hold up to handling. Got a couple better ideas, but won't spread them out here. Will see what Mike comes back with :-) Steve C -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian Sent: Thursday, March 04, 2010 3:46 PM To: [log in to unmask] Subject: Re: [TN] [LF] Soldering with Nanofoils Steve, 1) Also the company has now been bought by Indium Corporation of America. 2) The big challenge is how do you place the thin foil, especially in a high volume environment? I'm trying to interest people internally to see if it would be a good fit for when RF cans have to be reworked. Bev RIM -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner Sent: Thursday, March 04, 2010 3:30 PM To: [log in to unmask] Subject: Re: [TN] [LF] Soldering with Nanofoils Steve, I had some contacts with Nano Technologies, at one time they were right up the road from where I live. They were looking at doing some projects for automated use of the foil and since I knew PnP machines well and I wrote a lot of code it was a good match. I have played with the material, it is really neat stuff. You can do large scale soldering "In A Flash". As for the strength of the joints their demo kit had two 1 inch square pieces of solder coated copper. In a "Flash" they get soldered and you can not pull them apart. I tried it in a vise and a hammer trying to shear the two blocks. No Way. Bob Kondner -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick Sent: Thursday, March 04, 2010 1:34 PM To: [log in to unmask] Subject: Re: [TN] [LF] Soldering with Nanofoils Eric, Your question nicely leads into one that I have been pondering the last few days - the use of Nanofoils in soldering/SMD applications. I am just beginning to look into this but thought I might get some field experience opinions from the forums. One can go to the Reactive NanoTechnologies web site at http://www.rntfoil.com/site/ At least one design realization consists of a foil created by alternating layers of nm thick Al & Ni. Said foil would be placed between two solder-coated surfaces, or solder performs. The foil would be ignited [soldering iron, laser, etc] and the highly exothermic, self-propagating reaction would locally reflow the solderable surfaces creating a bond. The rapid exothermic process would minimize delta CTE issues between components, leaving the bulk temperature of the components well below what they would experience during a 'normal' reflow process. Leaving aside for the moment, any issues related to possibly having to physically hold the components in place during the process, I have two predominantly material questions - 1 - Has anyone attempted to use this in a production environment yet? 2 - What happens to the strength of the joints, assuming the by-products of the reaction stay within the interfacial region? Just curious. Seems like a nice tool looking for an application. Steve C -----Original Message----- From: Leadfree [mailto:[log in to unmask]] On Behalf Of Eric Bonatti Sent: Thursday, March 04, 2010 11:23 AM To: [log in to unmask] Subject: [LF] magnetic solders? Hello all, Have you folks seen this? http://www.articleant.com/gen/13521-new-magnetic-solders-are-a-leap-towards- green-alternatives.html I'm really curious to hear your thoughts on it. 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