Thanks for your response to my question. Would you happen to have any study or research paper to support the response below? I have a customer who is pushing me for a detailed evidence to show that Antimony Trioxide (Sb3O2) will not be formed during reflow of a product containing Sb5Sn solder paste. RESPONSE Not very likely. I believe for the reaction to occur between antimony and an amphoteric oxide, such as Sn1O2, you need temperatures above at least 800 deg. C. If you can get your reflow oven above 800 deg. C, the production of Sb2O3 will be the least of your worries. Bernard Asiedu Anadigics Inc 9086685000x5211 -----Original Message----- From: Stadem, Richard D. [mailto:[log in to unmask]] Sent: Thursday, March 25, 2010 1:37 PM To: [log in to unmask]; Bernard Asiedu Subject: RE: [TN] Formation of Sb3O2 during reflow Hi, Bernard Not very likely. I believe for the reaction to occur between antimony and an amphoteric oxide, such as Sn1O2, you need temperatures above at least 800 deg. C. If you can get your reflow oven above 800 deg. C, the production of Sb2O3 will be the least of your worries. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Bernard Asiedu Sent: Thursday, March 25, 2010 11:36 AM To: [log in to unmask] Subject: [TN] Formation of Sb3O2 during reflow Can Antimony Trioxide (Sb2O3) form during the reflow process if the solder paste contains an alloy of Antimony and Tin? --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------