Hello, I am looking for scanning equipment to measure flatness and coplanarity of BGA packages and would appreciate recommendations. We would like to place a JEDEC tray of balled packages and get readings for the whole tray in about a minute. This is to support high volume manufacturing. Ball pitch could be 0.4 - 0.5 mm or higher. If you have a recommendation, will you please also share what you like/dislike about it? Thanks for your help, Prashant Joshi Interconnect Systems Inc. (805) 482-2870 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------