Hello,

I am looking for scanning equipment to measure flatness and coplanarity of 
BGA packages and would appreciate recommendations.  We would like to place 
a JEDEC tray of balled packages and get readings for the whole tray in about a 
minute.  This is to support high volume manufacturing.  Ball pitch could be 0.4 -
0.5 mm or higher.  If you have a recommendation, will you please also share 
what you like/dislike about it?

Thanks for your help,

Prashant Joshi
Interconnect Systems Inc.
(805) 482-2870

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