Hello All, 
 
I'm working on the design of high speed line card for our high-end network router and plan to use buried capacitance to improve electrical performance. 

As known, both ZBC2000 and the next generation ultra-thin buried capacitance materials(3M C-Ply, FaradFlex BC24/BC16/BC12/BC16T) have advantages and disadvantages, respectively. To consider PCB manufacturing, PCB reliability, PCB cost, PCB lead-free assembly, and electrical perforance improvement, what kind of buried capacitance material is the best choice for high speed datacom products. Thanks a lot.

Best Regarads
Charming Chan


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