Hello All, I'm working on the design of high speed line card for our high-end network router and plan to use buried capacitance to improve electrical performance. As known, both ZBC2000 and the next generation ultra-thin buried capacitance materials(3M C-Ply, FaradFlex BC24/BC16/BC12/BC16T) have advantages and disadvantages, respectively. To consider PCB manufacturing, PCB reliability, PCB cost, PCB lead-free assembly, and electrical perforance improvement, what kind of buried capacitance material is the best choice for high speed datacom products. Thanks a lot. Best Regarads Charming Chan ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------