Hi Bev, Don't leave us hanging, what components are you seeing that with? I'd like to have a "heads-up". This begs the question, why do you think they are doing that? Are things getting so tight that they're trying to pinch a penny by reducing plating coverage? Hmmmm... Steve ----- Original Message ----- From: "Bev Christian" <[log in to unmask]> To: <[log in to unmask]> Sent: Thursday, March 25, 2010 9:08 PM Subject: [TN] Need some opinions > Technetters, > It seems that more and more component suppliers are not plating their > leads > all the way up to the component body. In fact some are getting downright > skimpy and only plating to the bottom bend, never mind the upper one. If > you > put down a lot of solder paste you end up with a bulbous joint, a negative > wetting angle and a stress concentration point. If you put down less paste > and have a co-planarity issue, then you have the potential for opens. The > other option of course is getting the supplier to plate higher up the > leads. > > Question: would you consider the condition of the formation of the > negative > wetting angles a failure during process qualification? > > Bev > RIM > > > ______________________________________________________________________ > This email has been scanned by the MessageLabs Email Security System. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------