Ken,
What are you looking for?
From: DesignerCouncil
[mailto:[log in to unmask]] On Behalf Of Harp, Ken
Sent: Wednesday, March 03, 2010 5:21 PM
To: [log in to unmask]
Subject: [DC] Pb-Free BGAs
Has
anyone had any experience / insight / success using underfill to increase the
solder joint fatigue life of a lead-free (SAC 405) sBGA?
R/
Ken
Harp
Mechanical
Engineer
425.376.4423
Powering your future
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
-------------------------------------------------------------------------------
DesignerCouncil Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in the
BODY (NOT the subject field):
SIGNOFF DesignerCouncil
To temporarily stop/(start) delivery of DesignerCouncil for vacation breaks
send: SET DesignerCouncil NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext. 2815
-------------------------------------------------------------------------------