Chris, Sorry, I can't open/display your links. Werner is going to remind you not to exceed 1.5ºC/second ramp rate on cool down. Dewey -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna Sent: Friday, February 12, 2010 9:45 AM To: [log in to unmask] Subject: [TN] Die cracks Hi TN We are in desperate need of QUICK expertise and/or opinions wrt the die cracks that can be seen from the links below. Sorry Steve, didn't want to circumvent you but I've got to come up with an opinion by EOD. BGA/CSPs were encapsulated in slow cure epoxy prior to excision. We section BGAs everyday and rarely see die cracks. I've got to decide whether we should recommend that the CM build up a few more for NDT (acoustics, CT..) I know: max cool-down was probably 2.2-2.8C/ second; ICT was not strain engineered or tested; SAC305 balls, paste; parts passed ICT, ..but cracks don't look to reach active circuitry Don't know: laminate, peak reflow Can't say: pretty much anything else Thanks! Chris https://robisan.sharefile.com/d-s7b37c04078d4889b https://robisan.sharefile.com/d-sc19f7716a0645489 https://robisan.sharefile.com/d-sb215d22cbf54972b https://robisan.sharefile.com/d-s22d269ff34d4018a ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------