Great, Bob. This is what I am looking for. Two Qs 1. The amendment is for J-STD-001 DS, will it cover J-STD-001? 2. Does " Surfaces exhibiting gold finish thicknesses of 0.254 micro-meters (10 micro-inch) or less (a.k.a. ''gold-flash'') are exempt from this requirement." cover SMT component? I guess so but it not clearly stated. Thanks. Regards, Dave He Ext: 333 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Landman Sent: Thursday, February 04, 2010 2:34 PM To: [log in to unmask] Subject: Re: [TN] Tinning gold-plated solder cup of connectors Gold flash is also exempt according to the amendment #1 of J-STD-001DS - isn't the SAMTEC part gold flash? http://www.ipc.org/4.0_Knowledge/4.1_Standards/J-STD-001DS-Amend1.pdf 3.9.3 Gold Removal Gold shall be removed from at least 95% of the surface to-be-soldered of all component leads, component terminations, and solder terminals. A double tinning process or dynamic solder wave may be used for gold removal. Exceptions: Electroless nickel immersion gold (ENIG) finishes on PCBs are exempt from this requirement. Surfaces exhibiting gold finish thicknesses of 0.254 micro-meters (10 micro-inch) or less (a.k.a. ''gold-flash'') are exempt from this requirement. These requirements may be eliminated if there is objective evidence approved by the user prior to use that there are no gold related solder embrittlement problems associated with the soldering process being used. Bob Landman H&L Instruments, LLC -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Gregg Owens Sent: Thursday, February 04, 2010 5:16 PM To: [log in to unmask] Subject: Re: [TN] Tinning gold-plated solder cup of connectors Dear Dave: J-STD-001's only exception to gold tinning is ENIG plated PCBs. Also it provides that the entire requirement be ignored if you have data to support that no gold embrittlement issues exist without pre-tinning. Gregg Owens Technical Writer - Avionics Space Exploration Technologies Corporation -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave He Sent: Thursday, February 04, 2010 12:19 PM To: [log in to unmask] Subject: [TN] Tinning gold-plated solder cup of connectors Does gold plated solder cup of connector need tinning per J-STD-001? Or is this a exemption? Thanks. Best regards, Dave He --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------