Irena, Can you be a bit more specific. Does the flex also have to go through reflow? Lead free reflow? How many times? How long does the flex have to survive 200 deg C for? A few minutes or indefinitely? Regards, On 23/02/2010 08:17, Irena Sumanteva wrote: > What kind of flex base materials to be used? Flex Circuit 2 layer which should operate at 200 C. > > Hi > Our customer is currently designing a device in which he intend to use flex pcb, 2 layer, 0.25mm board thickness. > Now what is interesting is that the device must be operation up to 200 degree Celsius. > > What kind of flex base material, coverlayer oand flex solder mask can withstand up to this temperature? > The present Pyralux coverlay does nto support the operational T of 200 C. > > If it exists, what is their coefficient of expansion of pcb material? > Can you send a link or other data sheet. > > Thank you in advance. > > Best regards, > Irena > > > > > ______________________________________________________________________ > This email has been scanned by the MessageLabs Email Security System. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > > -- Eric Christison Msc Mechanical Engineer Consumer& Micro group Imaging Division STMicroelectronics (R&D) Ltd 33 Pinkhill Edinburgh EH12 7BF United Kingdom Tel: +44 (0)131 336 6165 Fax: + 44 (0)131 336 6001 ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------