Hi, I also noticed a note on page 12: "Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module." I guess this implies traces and through holes are located on the part underside. If using NC is unacceptable as NC might affect high frequency operation (not something I really believe) and if other fluxes can not be cleaned without some kind of spacing lead attachment, then are we are saying this component is not useable as provided? Wow, I think we should step back and re-think before we claim the design of this component is seriously compromised. Did I miss something here? Bob Kondner -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D. Sent: Monday, January 18, 2010 11:01 AM To: [log in to unmask] Subject: Re: [TN] Low standoff module cleaning We use these parts in Hi-Rel applications, but we have a local company perform compliant lead attachment prior to our assembling the components. They use a laser soldering system to perform the compliant lead attachment, so the part is not heated up. If you want to contact them here is their website www.analog-tech.com. The parts cannot be soldered reliably without compliant lead attachment, even with a thicker stencil. The resultant solder joints when soldering directly to the pads are known to fail after about 1000 cycles, due to the large delta CTE. Also, the compliant leads did not affect the performance of the package from a signal impedance standpoint, but the reliability is about 10X better. With the compliant leads, you can clean under the part. NC flux will affect the performance of the package. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea Sent: Monday, January 18, 2010 9:27 AM To: [log in to unmask] Subject: [TN] Low standoff module cleaning Dear Technos, How many of you would solder this other than no-clean, see the -A2 option on page 7? www.meshnetics.com/ZigBit_OEM_Module_Product_Datasheet.pdf The assembled board needs to be conformally coated and will work outdoors, -25C to 60C range. One solution would be to bump the pads of the part with a thick stencil, but how high the part has to stand on the board to ensure good wash? Thanks, Ioan Tempea, ing. Ingénieur Principal de Fabrication / Senior Manufacturing Engineer T | 450.967.7100 ext.244 E | [log in to unmask] <mailto:[log in to unmask]> W | www.digico.cc <http://www.digico.cc/> N'imprimer que si nécessaire - Print only if you must --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------