Hello Technetters, We have some SC70 packages with NiPd gold plating that have wetting issues . Customer is using Kester R596L tinlead water soluble solder paste conducting eutectic reflow at 227C peak and have wetting issues.(first 3 images in PowerPoint). We have checked plating thickness with our supplier and it meets spec. EDX did not show any contamination, oxides etc. JEDEC solderability test passed. X-section shows some areas of missing nickel or gaps in coverage of base copper. I need the experts to look at the images and comment if this could be the root cause of poor wetting and non-wetting. I have forwarded the PowerPoint to Steven Gregory to post on his website. Your feedback will be much appreciated. Thank-you Mumtaz Bora Senior Quality Engineer Peregrine Semiconductor 9380 Carroll Park Drive San Diego, CA 92121 858-795-0112-direct 858-731-9499 -fax [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------