Hi Gregg! Just a couple of comments. Ultrasonic cleaning was viewed very skeptically for many years as there was a concern that the ultrasonic energy could cause damage at a component die/wirebond level for some component constructions/configurations. A couple of researchers in the UK (Richards/Foote were the authors I think - I have their report in the my archives somewhere) did some foundation investigation demonstrating that ultrasonic cleaning using 40 KHz transducers did not cause component damage. And there has been additional process investigation since that initial publication. You might check the IPC test methods and IPC cleaning guideline standards for additional information. Dave Hillman Rockwell Collins [log in to unmask] Gregg Owens <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 01/07/2010 01:28 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Gregg Owens <[log in to unmask]> To [log in to unmask] cc Subject [TN] ULtrasonic Cleaning of PCBAs Dear Technetters: I have been posed a question that I don?t have much experience with other than general knowledge. It there an ultrasonic cleaner system/setting available that can clean printed circuit assemblies (yes will electronic components)? With some pending designs there is a concern that our board houses will be able to sufficiently clean (deflux) under bottom only components/BGA style components. I know from the standards that ultrasonic cleaning is typically limited to bare boards so as to not damage internal interconnections/wire bonds. But I am wondering if there is a low setting available to agitate the solution while not destroy/damage components? Your thoughts are most appreciated. Gregg Owens Technical Writer - Avionics Space Exploration Technologies Corporation 1 Rocket Road | Hawthorne | CA | 90250 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------