Can someone please help me break my paradigm with "filling vias in process with solder"? I have difficulty seeing how this works. How do you ensure consistent, predictable solder fill in thermal vias during assembly? If inconsistent, then you really can’t count on it to be there since any time it’s not there you’ll pay for it. If by some chance you can get solder to fill all vias completely, then how do you avoid solder flowing out the opposite end of the vias? Protruding solder “bumps” can interfere with solder paste printing if bottom (second) side assembly is required. These solder “bumps” can also interfere with heat sinking if intimate contact is required in this area for heat dissipation. Regards, Randy On Tue, 29 Dec 2009 12:28:35 -0800, Dwight Mattix <[log in to unmask]> wrote: >Practically speaking, using "thermal conductive" and "CB100" in the >same sentence is an oxymoron. > > >Cu ~= 300 w/mK >Solder, Ormet, et al ~= 25 w/mk >CB100 ~=3 w/mK > >Small amount more annular copper, filling with Ormet paste (not a >cheaper option though) or filling via in process with solder yields >much greater increase in thermal conductivity than CB100. > >At 11:55 AM 12/29/2009, Joe Lara wrote: >>Hello TechNetter's, >> >>Im currently using Du Ponts "CB-100" Conductive Paste to vill Vias >>at $400 per 100G. Is >>there a more affordable way of filling vias that call out to be >>filled (thermal conductive) and >>plated? >> >> >>Best Regards, >> >>Joe >> >>--------------------------------------------------- >>Technet Mail List provided as a service by IPC using LISTSERV 15.0 >>To unsubscribe, send a message to [log in to unmask] with following text in >>the BODY (NOT the subject field): SIGNOFF Technet >>To temporarily halt or (re-start) delivery of Technet send e-mail to >>[log in to unmask]: SET Technet NOMAIL or (MAIL) >>To receive ONE mailing per day of all the posts: send e-mail to >>[log in to unmask]: SET Technet Digest >>Search the archives of previous posts at: http://listserv.ipc.org/archives >>Please visit IPC web site >>http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >>information, or contact Keach Sasamori at [log in to unmask] or >>847-615-7100 ext.2815 >>----------------------------------------------------- > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 15.0 >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp? Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 >----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------