Mumtaz, One can not measure such thin layers (Au in particular) with SEM, unless the sample was specially prepared (overplated with Ni). Did you do that? Regards, Vladimir SENTEC 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (416) 899-1882 Fax: (905) 882-8812 www.sentec.ca -----Original Message----- From: Mumtaz Bora <[log in to unmask]> Date: Wed, 13 Jan 2010 12:07:49 To: <[log in to unmask]> Subject: Re: [TN] NiPdGold Plating Soldering Issues Hi Victor, Yes, I have SEM/EDX images of the component. SEM was used for plating thickness measurements . Base material is copper. No idea on the dwell time from Nickel to Gold. Mumtaz Bora Senior Quality Engineer Peregrine Semiconductor 9380 Carroll Park Drive San Diego, CA 92121 858-795-0112-direct 858-731-9499 -fax [log in to unmask] SMTAI, October 6-7, 2009 in San Diego, CA - a world-class conference and exhibition devoted to electronics assembly. Visit www.smta.org/smtai for full details. For a free exhibit pass: http://smta.org/smtai/Free_Exhibits_Pass_SMTAI.pdf -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez Sent: Wednesday, January 13, 2010 6:49 AM To: [log in to unmask] Subject: Re: [TN] NiPdGold Plating Soldering Issues Do you have SEM/EDX photos of this sample/cross section? What instrument was used to measure the plating? XRF or SEM What is base material? Dwell time from nickel to Au plating? Vic, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: Tuesday, January 12, 2010 6:23 PM To: [log in to unmask] Subject: Re: [TN] NiPdGold Plating Soldering Issues Hi Mumtaz! It's been a long while since anybody has asked me to post anything on my webpage, TechNet has been pretty quiet for the last couple of months. I have been pretty quiet myself for awhile. I've had a lot of changes in my life recently. Anyways, I have your PowerPoint posted, it's here: http://stevezeva.homestead.com/Mumtaz.ppt Sure looks like "head-in-pillow" to me. Hope you have a good 2010. Kind regards, Steve Gregory --- [log in to unmask] wrote: From: Mumtaz Bora <[log in to unmask]> To: [log in to unmask] Subject: [TN] NiPdGold Plating Soldering Issues Date: Tue, 12 Jan 2010 14:56:12 -0800 Hello Technetters, We have some SC70 packages with NiPd gold plating that have wetting issues . Customer is using Kester R596L tinlead water soluble solder paste conducting eutectic reflow at 227C peak and have wetting issues.(first 3 images in PowerPoint). We have checked plating thickness with our supplier and it meets spec. EDX did not show any contamination, oxides etc. JEDEC solderability test passed. X-section shows some areas of missing nickel or gaps in coverage of base copper. I need the experts to look at the images and comment if this could be the root cause of poor wetting and non-wetting. I have forwarded the PowerPoint to Steven Gregory to post on his website. Your feedback will be much appreciated. Thank-you Mumtaz Bora Senior Quality Engineer Peregrine Semiconductor 9380 Carroll Park Drive San Diego, CA 92121 858-795-0112-direct 858-731-9499 -fax [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------