Hello All, 

I'm asking for help to understanding the section R6-176 and R7-13 in spec TELCORDIA GR-78-CORE Issue 2, thanks a lot.

R6-176 [336] Insulation thickness between adjacent PTHs and conductors shall be a minimum of 0.004 inch(0.0035 inch after accounting for isolated protrusions).  

Question: Does this section mean that the spacing between PTHs and conductors shall be a minimum of 0.004 inch?


R7-13 [426] Interconnection and circuit pack design rules shall include an interconductor voltage limit where wet(screen printed) solder masks are used. Above this voltage, dry film or demonstrated equivalent photoimageable wet solder mask shall be used; conformal coatings are a viable alternative.

Question: What's the specific voltage limit shall set up for wet solder mask?

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