Hello, I have a question about tinning the gold-plated SMT component as specified in J-STD-001, 3.9.3 bullet 2. As more and more SMT components, such as crystal, oscillator, inductor and connectors, are gold plated, the tinning becomes more and more difficult, especially for fine pitch components. Some gold plating is only 2-3 u" thick per the mfr. Some white paper also mentions if the gold is less than 3 wt% of the solder joint, there is no chance of embrittlement. I am searching professional idea for the gold removal on SMT component, will it be terminated if the thickness is less than a certain level? Thanks. Best regards, Dave He Process & Manufacturing Engineer Smart Electronics & Assembly, Inc. 2000 W Corporate Way Anaheim CA 92801 Phone: 714-991-6500 ext 333 Fax: 714-518-5411 www.smartelec.com --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------