The section in the 610 that addresses this is edge delamination. Is it inadequate? I would say you can use the 600 spec even after assembly. The assembly is a populated defect. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson Sent: Monday, December 14, 2009 10:22 AM To: [log in to unmask] Subject: [TN] Acceptability of Shredded Board Edge Greetings! We have an assembly where the board edge was ripped badly during depanelization. I searched through the Assembly Acceptability IPC-A-610 and didn't find much, but in the bare board IPC-A-600 section 2.1, I can see plainly that ours is rejectable. The question is, can I use the BARE BOARD spec to reject an ASSEMBLY? Or is there anything in the assembly specs that covers depanelization damage? thanks, Jack --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------