Ouch! Now that is a different way to hunt! Here in the US, hitting deer with a car is a problem in a number of states, especially the state of Wisconsin. Doug Pauls grew up in Wisconsin and has stated " there are two kinds of drivers in Wisconsin, those who have hit a deer and those who are going to hit a deer"! Hitting a moose would be a whole different matter! Dave "Inge" <[log in to unmask]> 11/07/2009 03:21 PM To "TechNet E-Mail Forum" <[log in to unmask]>, <[log in to unmask]> cc Subject Re: [TN] NTC - [TN] Solder Voids in Chip Components Hi Dave, here we use leadfree to, caliber 2 tons. Our cars. Hit a deer the other day, and my neighbour one deer yesterday. And today two moose calves passed our parking place. Mother moose was shot, becase she had just three legs. Traffic incident. I've deers in my garden every night. Not happy with them, eat our flowers, and the moose massacres our fruit trees. Well,shouldn't complain, many kilos of meat from both in the freezer. /Inge ----- Original Message ----- From: "David D. Hillman" <[log in to unmask]> To: <[log in to unmask]> Sent: Saturday, November 07, 2009 10:04 PM Subject: Re: [TN] NTC - [TN] Solder Voids in Chip Components Hi Bev - yea, I know but its Saturday, the leadfree ballistics investigation on North American waterfowl was excellent today and I happened to log into TechNet since the football games were slow. Dave "Bev Christian" <[log in to unmask]> 11/07/2009 02:54 PM To <[log in to unmask]>, <[log in to unmask]> cc Subject Re: [TN] Solder Voids in Chip Components Dave, I was playing devil's advocate. That is what we use too for non-thermal ones. I am also an active member of the BTC committee. Bev RIM ----- Original Message ----- From: TechNet <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Sent: Sat Nov 07 15:33:44 2009 Subject: Re: [TN] Solder Voids in Chip Components Hi Bev - the void criteria for a QFN/LGA ground/thermal pad that we use is 50% maximum voiding unless the component has specific thermal or grounding requirements impacted by voiding phenomena. The topic is also being discussed in the IPC BCT specification. Dave Hillman Rockwell Collins [log in to unmask] Bev Christian <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 11/07/2009 10:46 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Bev Christian <[log in to unmask]> To [log in to unmask] cc Subject Re: [TN] Solder Voids in Chip Components Inge, You get to play with the weirdest stuff! I was referring to "normal" cases. Something more down to earth though is voiding in LGA/QFN central thermal pads. What do people allow for that? Bev RIM ----- Original Message ----- From: Inge <[log in to unmask]> To: TechNet E-Mail Forum <[log in to unmask]>; Bev Christian Sent: Sat Nov 07 11:41:15 2009 Subject: Re: [TN] Solder Voids in Chip Components There is an exception, namely when you have to do with high power chips. We mounted HexFets that disspated 200 Watts, and those with too much voids simply burnt. By the way, I got no answer from Kevin about how to planarize heat via solder fills. Anyone? /Inge ----- Original Message ----- From: "Bev Christian" <[log in to unmask]> To: <[log in to unmask]> Sent: Saturday, November 07, 2009 5:10 PM Subject: Re: [TN] Solder Voids in Chip Components Correct. Or the voids are open to the surface, as Joyce K pointed out to me. Bev ----- Original Message ----- From: TechNet <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Sent: Sat Nov 07 11:02:58 2009 Subject: Re: [TN] Solder Voids in Chip Components Unless there is a significant "segregation" of rather small voids at one of the interfaces :-) Vladimir SENTEC 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (416) 899-1882 Fax: (905) 882-8812 www.sentec.ca -----Original Message----- From: Bev Christian <[log in to unmask]> Date: Sat, 7 Nov 2009 10:59:31 To: <[log in to unmask]> Subject: Re: [TN] Solder Voids in Chip Components Alejandro, No there is not. In the 10 years I was at Nortel we could never see any significant difference between shear strength of solder joints with low voiding and those that looked like Swiss cheese (up to 50% voiding). I am sure that Werner will come back and rightly say that shear strength does not necessarily equate to solder joint reliability. But I can say we never saw chip cap problems that were traceable to the joint voids. Bev ----- Original Message ----- From: TechNet <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Sent: Sat Nov 07 10:40:25 2009 Subject: [TN] Solder Voids in Chip Components Hello, Does anybody know if there is an IPC specification that describes the amount of solder voids allowed in a chip component solder joint? The IPC-A-610 Rev D is specific describing the % of voids allowed for BGA's solder joints (<25%) only but not for any other type of components. Saludos Cordiales / Best Regards Alejandro A. 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