Hi Doug! Send them here: [log in to unmask] Steve -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Pauls Sent: Monday, November 30, 2009 8:29 AM To: [log in to unmask] Subject: Re: [TN] BGAs & Conformal Coating Good morning Juan, I suspect that Xilinx wants you do do a thermal cycle study on solder joint reliability when conformal coating gets under the BGA. The stresses brought about by a mismatches in the coefficient of thermal expansion (CTE) can rip a BGA off the board and can severely deform the balls. Hillman and I did such a study here a few years ago. I can share a few pictures of what happens, if Steve Gregory would be kind enough to forward his present e-mail address for the photos. Not sure I have the right one. Doug Pauls "Juan T. Marugán" <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 11/26/2009 11:53 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to "Juan T. Marugán" <[log in to unmask]> To [log in to unmask] cc Subject [TN] BGAs & Conformal Coating Hi, I've read in a Xilinx guide that: "Xilinx has no experience or reliability data on flip-chip BGA packages on board after exposure to conformal coating. It is recommended that the end-user should characterize the board level reliability performance of Xilinx packages before production use." Does anybody know any infomation or study related with this topic? Thank you. Juan T. Marugán Indra Sistemas SA Espańa --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------