Hello Eric, For moisture sensitive package handling, storage ,packaging and floor life after opening bags, please refer to J-STD-033B.1 . Please go to www.jedec.org to view the standard. Mumtaz Bora Senior Quality Engineer Peregrine Semiconductor 9380 Carroll Park Drive San Diego, CA 92121 858-795-0112-direct 858-731-9499 -fax [log in to unmask] SMTAI, October 6-7, 2009 in San Diego, CA - a world-class conference and exhibition devoted to electronics assembly. Visit www.smta.org/smtai for full details. For a free exhibit pass: http://smta.org/smtai/Free_Exhibits_Pass_SMTAI.pdf -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric CHRISTISON Sent: Wednesday, November 04, 2009 7:34 AM To: [log in to unmask] Subject: Re: [TN] Component Shelf Life What about moisure sensitivity? I'm thinking about MSL classifications which are outlines in a Jedec spec which I can't lay my hands on right now? A bit of a vague question. Regards, Bev Christian wrote: > Paymon, > Gregg hit it on the nail head. > > In addition, it is going to depend on finish, finish thickness > (varies) and what your level of acceptability is (which IPC class > product do you build?). > > I also do not know of a published, recent standard on this topic. > Bev > RIM > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani > Sent: Wednesday, November 04, 2009 9:54 AM > To: [log in to unmask] > Subject: [TN] Component Shelf Life > > Dear Colleagues, > > I am looking for a standard for component shelf life. Is anyone aware > of such document? > > Best Regards, > > Paymon Sani > Quality Engineer > Creation Technologies > > Office: 905.754.5000 x 5363 > 110 Clegg Road | Markham, ON, Canada | L6G 1E1 > [log in to unmask]<mailto:[log in to unmask]> | > www.creationtech.com<http://www.creationtech.com/> > > [cid:[log in to unmask]]Working together to build the > future > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 To > unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt > or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing > per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: > http://listserv.ipc.org/archives > Please visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional > information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 > ext.2815 > ----------------------------------------------------- > > --------------------------------------------------------------------- > This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful. > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 To > unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt > or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET > Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the > posts: send e-mail to [log in to unmask]: SET Technet Digest Search the > archives of previous posts at: http://listserv.ipc.org/archives Please > visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at > [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- > > -- Eric Christison Msc Mechanical Engineer Consumer & Micro group Imaging Division STMicroelectronics (R&D) Ltd 33 Pinkhill Edinburgh EH12 7BF United Kingdom Tel: +44 (0)131 336 6165 Fax: + 44 (0)131 336 6001 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------