By specially trained eyes, you can detect HOP. Of course, after you looked at few dozen of those good and bad side by side. You do see a shadow for the HOP device. You need many cups of coffee to enhance your vision. You basically treat it as a ground hog. -------------------------- Sent using BlackBerry ----- Original Message ----- From: TechNet <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Sent: Tue Oct 06 14:18:42 2009 Subject: Re: [TN] BGA X-Ray Defect Detection Capabilities Sounds like I’ve been led down a rosy pathway. I thought these machines would do everything but serve you a cup of coffee. Both of them were 3D with an option to inspect in 2D (or provide a combination of the two). If the 3D option is utilized and indeed inspecting every solder joint on one BGA, can the machine be “tweaked” enough to assure we’ll catch all the opens, non-wets, and head-in-pillows? If not, I’ve got to back up and punt, and the defensive line is bearing down quickly! Are there any other suggested options (other than not building a defect in the first place)? Nothing ever goes as planned… Leland From: [log in to unmask] [mailto:[log in to unmask]] Sent: Tuesday, October 06, 2009 1:44 PM To: [log in to unmask]; Leland Woodall Subject: Re: [TN] BGA X-Ray Defect Detection Capabilities Hi Leland, John Burke gave you good advice. Forget 2-D for the defects you are interested in, and 3-D is not much better except for some very specialized machines that look at SJs individually—bad part is of course, not very useful in mass production. Werner -----Original Message----- From: Leland Woodall <[log in to unmask]> To: [log in to unmask] Sent: Tue, Oct 6, 2009 11:55 am Subject: [TN] BGA X-Ray Defect Detection Capabilities Everyone, I just came back from an X-ray vendor qualification trip, and of course, have a few questions for my professional peers. Both vendors experienced problems reliably detecting opens and non-wets. I really didn't expect to see this, as I thought these would be two of the most common defects seen among BGA users. We had to leave boards at both facilities so they could further develop their algorithms. We were not able to create a head-in-pillow defect, and thus, were not able to check their machines for this. They also had no sample boards that carried such an anomaly. Is this another defect that is difficult to detect, and must one utilize a 3D machine in order to fi nd it (assuming the machine is capable of both 2D and 3D inspections, and there are no components beneath the BGA)? Are there any other caveats you might be able to provide? Our list of questions and qualification efforts were extensive, but I'm certain we missed something. I just hope whatever it was fell outside of being a critical item... Thanks in advance, Leland --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------------------------- This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.