Sure you can, but it wouldn't be a conventional way (too expensive). As one would say in Russian; more expensive then a brick bridge :-) Vladimir SENTEC 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (416) 899-1882 Fax: (905) 882-8812 www.sentec.ca -----Original Message----- From: Inge <[log in to unmask]> Date: Wed, 21 Oct 2009 18:37:44 To: <[log in to unmask]> Subject: Re: [TN] ENIG Issue Vlad, Why not? You can etch with beam step by step into the pads and get an excellent depth profile too. /Inge ----- Original Message ----- From: "Vladimir Igoshev" <[log in to unmask]> To: <[log in to unmask]> Sent: Wednesday, October 21, 2009 5:55 PM Subject: Re: [TN] ENIG Issue > Well, Auger would be an "overkill" for the case. > > Vladimir > SENTEC > 11 Canadian Road, Unit 7. > Scarborough, ON M1R 5G1 > Tel: (416) 899-1882 > Fax: (905) 882-8812 > www.sentec.ca > > > -----Original Message----- > From: "Meeks, Stephen" <[log in to unmask]> > Date: Wed, 21 Oct 2009 08:26:35 > To: <[log in to unmask]> > Subject: Re: [TN] ENIG Issue > > Bill, > > You may have a surface nickel issue that is affecting the solderability. > There are very few in-line fixes, but for root cause, conduct a surface > analysis study for a nickel rich surface (Auger). There may have been an > issue during the fabrication ENIG process. > > Quick Test > 1. Apply only solder paste to the panel conduct reflow (bottom or top) > 2. Apply only solder paste to the second side and conduct reflow. > 3. The "non" or dewetted panel will serve as a talking point with the > board supplier. > > Stephen Meeks, Jr. > Tel +1 480 502 6428 > Fax +1 480 502 6400 > [log in to unmask] > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask] > Sent: Tuesday, October 20, 2009 4:21 PM > To: [log in to unmask] > Subject: [TN] ENIG Issue > > Fellow TechNetters: I ran into a problem and I am looking for more > information. We had some PCB made with ENIG for SMT applications. We > populated the backside, ran them through the convection oven, the solder > fillets were fine. Populated the first five (5) PCBs on the topside, > ran them through the convection oven, and the solder fillets were quite > bad, actually dewetted. Could not even be touched up. Tried two (2) > more random PCBs and got the same results. Never have run into this > before but have been told it is NOT a unique problem. Has anybody had > this happen? Have to tell our customer that they are not going to be > getting their PCBs on time and would rather not look like the north end > of a southbound mule. > > > > Thanks in advance for your assistance. > > > > Bill Black > > 1 631 667 9699 X13 > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text > in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: > http://listserv.ipc.org/archives > Please visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 > ext.2815 > ----------------------------------------------------- > This communication, including any attachments, may contain information > that is proprietary, privileged, confidential or legally exempt from > disclosure. 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