Is the pictures in IPC-A-610D section 10.2.2 (10.13 and 10.14) represent fingerprint outline? Just wondering, Thanks, Jon -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah Sent: Tuesday, October 20, 2009 8:05 AM To: [log in to unmask] Subject: Re: [TN] delamination signatures Yes of course Bob. She was traced and fired immediately (as reported by the Chinese vendor). Best Regards Reuven ROKAH Think green before printing this mail... Thanks -----Original Message----- From: Bob Willis [mailto:[log in to unmask]] Sent: Tuesday, October 20, 2009 2:52 PM To: 'TechNet E-Mail Forum'; Reuven Rokah Subject: RE: [TN] delamination signatures Nice one I will have to search through my library for all the other things we use to leave inside boards. Guess you can do a CSI with the finger print and run it through Codus and find the person responsible. Bob Willis 2 Fourth Ave, Chelmsford, Essex, CM1 4HA England Tel: (44) 1245 351502 Fax: (44) 1245 496123 Mobile: 07860 775858 www.ASKbobwillis.com www.SolderingStandards.com New Package on Package Workshops 24th November www.ASKbobwillis.com/PoPWorkshops.pdf PCB Inspection & Quality Control Workshop 3rd November www.ASKbobwillis.com/faworkshops.pdf Book Bob's "Step by Step Failure Analysis Workshop"4th November www.ASKbobwillis.com/faworkshops.pdf Package on Package Assembly & Inspection Workshops 21th January ITRI www.ASKbobwillis.com/PoPWorkshops.pdf -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah Sent: 20 October 2009 10:03 To: [log in to unmask] Subject: Re: [TN] delamination signatures There is also delamination caused by finger print stain on inner layers. It usually round and have its finger print size. Best Regards Reuven ROKAH e mail: [log in to unmask] Think green before printing this mail... Thanks -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna Sent: Tuesday, October 20, 2009 3:24 AM To: [log in to unmask] Subject: [TN] delamination signatures Hello TN, I'm wondering how certain one can be about the root cause of delam. simply by reading its signature. Our experience is similar to Paul Reid's (post attached below). One obvious question: what about when it is both co and adhesive failure? Are there other features to the signature that are important in determining primary root cause? Chris ------------------------------------------------------------------------------------------ My sense is that moisture induced delamination presents as adhesive delamination that is horizontal cracks that resemble blisters and are located at a laminated interface (b-stage to c-stage or copper, or along bundles of glass). It may be that the vapor pressure exerted by trapped moisture induces a mechanical failure at laminated interfaces. Material degradation induced delamination more often presents as cohesive failure that may exhibit cracks with vertical sections, often bifurcating and spanning across b-stage and c-stage material, even through glass bundles, and tend to propagate with sharper angles. This failure mode appears to be more a chemical degradation of the epoxy system. Sincerely, Paul Reid --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- This communication is intended only for use by the addressee(s) named herein and may contain business confidential and/or legally privileged information. If you are not the intended recipient of this e-mail, you are hereby notified that any dissemination, distribution, disclosure or copying of this e-mail and its contents is strictly prohibited. If you have received this e-mail in error, kindly notify the sender by replying to this message. In addition, please permanently delete the message and any attachments without copying or disclosing the contents. Thank you for your cooperation. THIS DOCUMENT AND/OR SHIPMENT MAY CONTAIN COMMODITY ITEMS, SOFTWARE OR TECHNICAL DATA THAT IS CONTROLLED BY U.S. EXPORT LAW, AND MAY NOT BE EXPORTED OUTSIDE THE UNITED STATES OR TO NON U.S. PERSONS WITHOUT THE APPROPRIATE EXPORT LICENSE FROM EITHER THE U.S. DEPARTMENT OF STATE OR DEPARTMENT OF COMMERCE.