Yeah, that's one of the reasons we're looking for something better. I like the looks of that HSP 2741 stuff, seems you can build up an entire HS on the back of the PCB with it. Pretty cool Ken -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW Sent: Wednesday, October 28, 2009 4:06 PM To: [log in to unmask] Subject: Re: [TN] Via fill for heat transfer You're still using CB100?! This material causes problems with most anything but the most tame processes and materials. It outgases with multiple reflow cycles--if you use it for a via-in-pad it can cause the solder to "rot". Copper conducts real well, so extra plating/more vias do a great job. In conjunction with solder fill and multiple board planes I have always been able to get the heat out of the part. Wayne Thayer -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Kenneth Wood Sent: Wednesday, October 28, 2009 3:51 PM To: [log in to unmask] Subject: [TN] Via fill for heat transfer Hi all, Is there a specific material I can use for via fill that is best for heat transfer for thermal vias? I use CB100 now but would like to know if there is something better I can use. Thanks Ken --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- This e-mail and any files transmitted with it may be proprietary and are intended solely for the use of the individual or entity to whom they are addressed. If you have received this e-mail in error please notify the sender. Please note that any views or opinions presented in this e-mail are solely those of the author and do not necessarily represent those of ITT Corporation. The recipient should check this e-mail and any attachments for the presence of viruses. ITT accepts no liability for any damage caused by any virus transmitted by this e-mail. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------