Just share some idea:

1. The thickness of Nickel and Gold thickness;
2. Prolonged exposure of the PCB in the reflow/wave consumes the flux on the
surface and starts to attack the Nickel. As Nickel erosion continues and the
intermetallic is consumed, the bond quality is compromised.


2009/9/23 peter gong <[log in to unmask]>

> Johnson,
> In my view, there are no "PCB black pad issue" from your picture, but I
> really don't know what is the real problem in your production line. The info
> you provided is so not clear!
>
> Best Regards
>
> 龔岳曦
> *Peter Gong*
> cellular phone:China 13417366601
> MSN: [log in to unmask] <mailto:[log in to unmask]>_
>
>
>
>
> On Wed, Sep 23, 2009 at 3:13 PM, Johnson Hu <[log in to unmask]>wrote:
>
>>
>>
>> Could somebody advise the root cause for PCB black pad and the potential
>> risk of Products with black pad.
>>
>
>