Paul, ASTM B-579, Standard Specification for Electrodeposited Coating of Tin-Lead Alloy (Solder Plate), is normally used. I do not know of an IPC specification for this process. Regards, Tom Carroll, CQA, CIT Supplier Quality Engineer Boeing Integrated Defense Systems - East Region Supplier Quality Home Office Phone/FAX: 845-753-5932 Temp Office Phone at Alabama Aircraft Indus Inc (205) 510-4783 Temp Office FAX at AAII (205) 592-0295 Boeing Cell: 215-692-2463 email: [log in to unmask] > NOTE: This communication may contain privileged or other confidential information. If you are not the intended recipient, or believe you have received this communication in error, please do not print, copy, retransmit, disseminate, or otherwise use the information. Also, please indicate to the sender that you have received this e-mail in error, and delete the copy you received. Thank you. > EXPORT COMPLIANCE STATEMENT: > "The information contained herein is or may be controlled by the International Traffic in Arms Regulations (ITAR), 22 CFR 120-130, and may not be exported, or disclosed to a foreign person, whether in the United States or abroad, without prior U.S. Government written approval" -----Original Message----- From: Paul Reid [mailto:[log in to unmask]] Sent: Friday, September 04, 2009 8:25 AM To: [log in to unmask] Subject: [TN] Tin Lead Plate Specification One of our customers is asking for IPC specifications for electroplated tin lead. My sense is that plated tin lead may not be specified by IPC as it is an intermediate step in PWB fabrication. Intermediate in that tin lead may be used as an etch resist that is later fused to produce a solder finish, subjected to HASL and replaced in the process, or stripped for the application of another surface finish like ENiG. Is there a specification for tin lead plating and, if so, can someone direct me to the appropriate document? Sincerely, Paul Reid Program Coordinator PWB Interconnect Solutions Inc. 235 Stafford Rd., West, Unit 103 Nepean, Ontario Canada, K2H 9C1 613 596 4244 ext. 229 Skype paul_reid_pwb [log in to unmask] <mailto:[log in to unmask]> --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------