It appears that Linda Langley's experience backs up your comment completely. Rudy Sedlak RD Chemical Company --- On Fri, 9/18/09, [log in to unmask] <[log in to unmask]> wrote: From: [log in to unmask] <[log in to unmask]> Subject: Re: [TN] Black Pad To: "TechNet E-Mail Forum" <[log in to unmask]>, "R Sedlak" <[log in to unmask]> Cc: [log in to unmask] Date: Friday, September 18, 2009, 6:53 AM Hi Rudy - actually, if the copper and tin form an intermetallic phase during your first pass thru the reflow oven (which they should) then you would have solderability issues during subsequent soldering operations. Dave Hillman Rockwell Collins [log in to unmask] R Sedlak <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 09/18/2009 08:44 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to R Sedlak <[log in to unmask]> To [log in to unmask] cc Subject Re: [TN] Black Pad Linda: Actually, it is quite possible to get black immersion Tin. It comes from running a bath with an excess of Cupric Copper in it. I wrote a article on how to monitor Cupric Copper in immersion Tin baths to avoid this in a recent PCD&F magazine. The black color should not affect solderability, as it is actually immersion Copper on top of the Tin. Rudy Sedlak RD Chemical Company --- On Fri, 9/18/09, Linda Langley <[log in to unmask]> wrote: From: Linda Langley <[log in to unmask]> Subject: [TN] Black Pad To: [log in to unmask] Date: Friday, September 18, 2009, 3:12 AM I know we have had this subject many times before so I did go to the archives and still can't find an answer. My question, is Black Pad only associated with ENIG? Is it possible with immersion Tin? Linda Langley CIT Training Specialist Jabil Circuit 248-292-6176 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------