Thanks David, you did a very good job and it's amazing how much intelligence and fun has been flowing through the fibers since then. I congratulate you and wish you all the best and may you prosper and live long and be happy with what you have done for one mille nuts...erh...netters. Inge ----- Original Message ----- From: "David Bergman" <[log in to unmask]> To: <[log in to unmask]> Sent: Friday, September 04, 2009 7:59 PM Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability Hi Inge, The formation of Technet was my idea. It came during a brainstorming discussion with one of our TAEC Chairs Al Sorkin on how IPC should start communicating using something called "e-mail" and get involved in the world wide web. Al talked about email reflectors which led to the thought of having a networking tool for the members to ask technical questions. That lead us to install our "Pine" email system and early registration of the domain www.ipc.org. Time frame was early nineties, I would have to really dig to get more specific. We have technet archives back to 1995. I believe 95 and 96 were ported over. A post by Steve Gregory of Pragmatech on 25-APR-95 implies that it had been running for a bit. Good day! First I would like to express my thanks for the inputs I have received in response to several of my requests in the past. They have all been very helpful in resolving the issues that I needed help on, or when I needed "another voice" to echo my position on certain issues. I think we all get busy and sometimes neglect to acknowledge the efforts of others. / / \(..)/ ----- * Steve Gregory ////// ' \/ ` ---- * [log in to unmask] */*/ * // : : --- * Pragmatech Incorporated * /` '-- * 101 Nicholson Lane *//..\\ San Jose, California 95134 Best regards, Dave David W. Bergman 大山人 Vice President, International Relations IPC - Association Connecting Electronics Industries 3000 Lakeside Drive Suite 309 S Bannockburn, IL 60015-1249 USA +1 847-597-2840 tel +1 847-615-5640 fax +1 847-867-1388 mobile [log in to unmask] www.ipc.org -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Sent: Friday, September 04, 2009 12:40 PM To: Listserv Technet Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability What about the decomposition time for TechNetium? Seems to be a very stable element , because we are same number of members since the start. A thought came up in my mind: when did TN start and who was the creator ? /Inge ----- Original Message ----- From: "Werner Engelmaier /*" <[log in to unmask]> To: <[log in to unmask]> Sent: Friday, September 04, 2009 4:12 PM Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability > Hi Joe, > > In the '80's, we at Bell Labs tries round, and rectangular pads. The ATC > results showd a slight reliability advantage for solder joints resulting > from rectangular pads. I have a paper in SMI sometimes in the early '90's > [Bell Labs management would not let it be published at the time] with the > data. The reason for the rectangular pads , by the way, was smaller > possible pitch. > > Werner > > > -----Original Message----- > From: Joe Fjelstad <[log in to unmask]> > To: [log in to unmask] > Sent: Thu, Sep 3, 2009 8:10 pm > Subject: [TN] BGA/LGA land shape versus assembly yield reliability > > > > > Greetings folks. > > I did a quick check of the archives on the subject and drilled a dry well > (maybe drilled in the wrong place?). > > That said, in design and lay out we all tend to match pad shapes on the > board with their mates on the package (round hole - round peg , square > hole - > square peg) > > My question is has anyone looked at (or know of) round with square and > vice versa and collected assembly efficacy/results and/or reliability > data? > > Finite Element Modeling data would be of interest as well. > > Thanks in advance for any responses > > Joe > > Since its Friday in some place of the world (or soon will be) I was > looking > over the period table recently and afterwards was wondering if anyone had > ever mentioned that this little forum has it very own element, > TechNetium, > the first man made element. (the upper case N is my suggestion for future > spelling... ;-) > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for > additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------