Jim, I believe what they're attempting to convey is there is a micro etch before the OSP process to clean the copper. They have to test prior to OSP so that is the reasoning they're giving for not catching the open(s). It looks like there's barely any copper in the holes. What requirement were they building and inspecting to? Unless they left the panels in a micro etch and forgot about them there's no way a proper pre-clean using micro etch would remove that much copper. Send 'em back!!! Dan S. ----- Original Message ----- From: "J W" <[log in to unmask]> To: <[log in to unmask]> Sent: Wednesday, September 09, 2009 10:41 AM Subject: [TN] PTH problem Hi TechNet group, I'm really getting nervous about a China bare board supplier and their quality and need your opinions. Please take a look at the picture by clicking on the link below showing two plated through holes (via's). The problem reported originally was a bad ground connection between ground via's and ground planes. As you can see, the pictures are very telling, and you can clearly see the ground plane not connected (several planes not connected actually). What I'm also nervous about is the comment listed below the pictures "The plated copper on PTH surface will be etched thin after OSP process". Is that statement correct? I'm not a bare board expert by any means, but I believe a PTH should have a little more copper than what is shown? I know that OSP is not something new, so are other board suppliers dealing with the same issue of possible thin PTH walls because of OSP? I also submitted pictures early last week regarding the same supplier having problems with the their solder mask process, so to me, I'm thinking this board shop is not up to standards and we should inform out board assembler house to look for another supplier...immediately? Thanks for your help! Jim http://stevezeva.homestead.com/PTH_Connection_issue.jpg --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------