When reworking Gull Wing devices by hand, and using a broad tip, I would expect a round pad to pull the solder filaments away from each other. I never played with that. Has anyone tried it? Bob Kondner -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Sent: Friday, September 04, 2009 1:40 PM To: [log in to unmask] Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability What about the decomposition time for TechNetium? Seems to be a very stable element , because we are same number of members since the start. A thought came up in my mind: when did TN start and who was the creator ? /Inge ----- Original Message ----- From: "Werner Engelmaier /*" <[log in to unmask]> To: <[log in to unmask]> Sent: Friday, September 04, 2009 4:12 PM Subject: Re: [TN] BGA/LGA land shape versus assembly yield reliability > Hi Joe, > > In the '80's, we at Bell Labs tries round, and rectangular pads. The ATC > results showd a slight reliability advantage for solder joints resulting > from rectangular pads. I have a paper in SMI sometimes in the early '90's > [Bell Labs management would not let it be published at the time] with the > data. The reason for the rectangular pads , by the way, was smaller > possible pitch. > > Werner > > > -----Original Message----- > From: Joe Fjelstad <[log in to unmask]> > To: [log in to unmask] > Sent: Thu, Sep 3, 2009 8:10 pm > Subject: [TN] BGA/LGA land shape versus assembly yield reliability > > > > > Greetings folks. > > I did a quick check of the archives on the subject and drilled a dry well > (maybe drilled in the wrong place?). > > That said, in design and lay out we all tend to match pad shapes on the > board with their mates on the package (round hole - round peg , square > hole - > square peg) > > My question is has anyone looked at (or know of) round with square and > vice versa and collected assembly efficacy/results and/or reliability > data? > > Finite Element Modeling data would be of interest as well. > > Thanks in advance for any responses > > Joe > > Since its Friday in some place of the world (or soon will be) I was > looking > over the period table recently and afterwards was wondering if anyone had > ever mentioned that this little forum has it very own element, > TechNetium, > the first man made element. (the upper case N is my suggestion for future > spelling... ;-) > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for > additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------