Hi Gregg, I believe the big concern in 610 and 001 is the inability to rework the solder joint, if required, when there is bonding on it. As far as reliability I believe that you could screen for that during qualification testing. KennyB -----Original Message----- From: Gregg Owens [mailto:[log in to unmask]] Sent: Monday, September 28, 2009 1:58 PM To: [log in to unmask] Subject: [TN] Component Staking Hello all, It's good to be back on TechNet once again. I have a question I could directly answer so I thought I would put it out to the friendly experts of TechNet. After soldering and during the component staking process some adhesive has migrated onto adjacent solder connections and land areas. Could this become detrimental in a high vibration environment? I know from 610 and 001 that adhesive shall not contaminate the creation of the solder connection. However this is AFTER the soldering process is complete would this be a concern? Any thoughts? Thanks in advance, Gregg Owens, CIT Technical Writer - Avionics Space Exploration Technologies 1 Rocket Road | Hawthorne | CA | 90250 310-363-6000 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------