Yes we have did a microsection and the hole wall are within specs and no damage except there is a crack at the entering rim of the via hole. Suspect that is caused by the customer who have scrapped the soldermask and use manual probe to check the circuitry and had caused the damage to it. This crack so happened to break off the connection to the circuitry. Currently I have requested my customer to give me a open circuit board with their additonal damage to the via hole, I will send it to a 3rd party body to do the analysis. I am now waiting for the reject board to come in.
Thanks for you advise.
From: Steve Tam <[log in to unmask]>
Subject: Re: [TGAsia] via hole issue
To: [log in to unmask]
Date: Wednesday, 29 July, 2009, 3:00 PM
It can’t really tell by judging the 2 photos whether the hole had open problem. Scratched soldermask normally would not caused via hole open, rather it is the copper plating in hole wall. The best way is to conduct a cross-section to confirm.
Cross-section is a simple process which most of the PCB shops and laboratories can perform.
Hope the above helps.
Regards,
Steve Tam
Santis Substrates Ltd
T: (852)2414 3993-ext 1130
F: (852)2416 5319
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Patricia Lui
Sent: Wednesday, July 29, 2009 11:32 AM
To: [log in to unmask]
Subject: [TGAsia] via hole issue
I have customer complained that the via holes of my board had caused open circuit. I have took one piece of board and found that the via hole opening on my board is being scrapped. I was told that the assembly house had scrapped of the soldermask at the via hole to get contact point for them to use a multimeter to check the connection. I have told them that due to their damage to the via hole had cause the open circuit but they do not agree. They even claimed that they have not send such badly damage via hole reject board to me and had took out an x-ray photo to prove.
Can I have your expertise with x-ray photos to advise me if the rim of a via hole is being scrap will it show on the x-ray photo? does the attached x-ray photo match with the PCB via hole photo?
I am also looking for a company or organisation who can do this fault analysis for my reject board as analysis done by my factory is not accepted by my customer, there are too much dispute. I need to get a 3rd party to do the analysis. Can anyone advise me is there such organisation or company in China who can help to do the board reject analysis?
Hope to receive your favourable advise.
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