Dear Brandon,

 

We are using alcohol-based ,no-clean  flus which solid content is 2.5+-0.5%,

 

Best Regards

Charles Lee

 


From: TGAsia [mailto:[log in to unmask]] On Behalf Of Brandon Tang
Sent: Friday, August 21, 2009 8:04 AM
To: [log in to unmask]
Subject: Re: [TGAsia] Solder Balls

 

Charles

What flux is used on your PCBA , alcohol-based or water-based ? what’s the solid content of flux?  and is there large pad around PTH connector to absorb heat during wave solder  ?

Brandon

 


From: TGAsia [mailto:[log in to unmask]] On Behalf Of Maker Cheng
Sent: 2009820 17:58
To: [log in to unmask]
Subject: Re: [TGAsia] Solder Balls

 

Hi Charles,

Usually, we can’t control the solder appear well during the reflow process or wave solder process. Note: IPC-A-610D has defines the solder ball criteria in Section.5.2.6.1, there are many comment for accept the PCBA with solder ball residue.

 

Is wash process or not wash process in your factory? Maybe you can clear out the solder ball with brush and wash process.

 

Maker.


From: charles.lee [mailto:[log in to unmask]]
Sent: Thursday, August 20, 2009 10:10 AM
To: Cheng, Maker (
程仁明 IES); [log in to unmask]
Subject: RE: [TGAsia] Solder Balls

 

Dear Maker,

 

It’s definitey  difficult to remove so many solder balls via ESD brush since they are too small. Another potential problem  is that  the sodler balls will become movable balls to hide into pins of  ICs after brush.

 

Best regards

Charles Lee

 


From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, August 20, 2009 9:35 AM
To: [log in to unmask]; [log in to unmask]
Subject: RE: [TGAsia] Solder Balls

 

Hi Charles,

If you can not prevent the solder ball appear in you process well, you can clear out the solder ball with ESD brush in you touch up station after wave solder process to meet IPC standard.

 

Maker.


From: TGAsia [mailto:[log in to unmask]] On Behalf Of Charles Lee(SVA)
Sent: Wednesday, August 19, 2009 11:03 AM
To: [log in to unmask]
Subject: [TGAsia] Solder Balls

 

Dear All,

 

There are a great deal of tiny solder balls appeared in around PTH connector pins after wave soldering (PB Process) , please see the attached pictures.

 

Here we would like to seek your helps and suggestions on how to solve the solder ball issues, thanks!

 

Best regards

Charles Lee