Joyce, Even an acrylic PSA can get a little squishy at thermosonic temps. Have you had to deal with stiffeners attached with silicone in the past? Steve -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo Sent: Tuesday, August 04, 2009 2:48 PM To: [log in to unmask] Subject: Re: [TN] Wire bond Attached with silicone? -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly Sent: Tuesday, August 04, 2009 1:55 PM To: [log in to unmask] Subject: Re: [TN] Wire bond Hi Inge - flex? - 18 micron copper on adhesiveless kapton - stiffener underneath. Regards Steve -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Sent: August-04-09 1:52 PM To: [log in to unmask] Subject: Re: [TN] Wire bond Ceramic : No FR-4 : No LTCC: No Glass: No Steel: No Teflon: Yes /Inge ----- Original Message ----- From: "Steve Kelly" <[log in to unmask]> To: <[log in to unmask]> Sent: Tuesday, August 04, 2009 5:36 PM Subject: [TN] Wire bond Good Morning, Does the size of a wire bond pad (in this case with a perfect etch .002 wide) have any effect on whether the wire bonder does Al wedge or Thermosonic gold( I know the gold plating is different) - just asking about the process. Thanks. Steve Kelly Steve Kelly (PLEASE NOTE NEW E-MAIL ADDRESS) (416) 750-8433 (work) (416) 750-0016 (fax) (416) 577-8433 (cell) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------------------------- This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. 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