I am working on a layout that has a 0.65mm 14x14 matrix bga on an 0.062 thick board. I have to be able to place through hole vias between the pads. Would love to use 3 and 3 spacing. Who out there can advise me about this? Yes, the board HAS to be 0.062 thk...has a card edge connector...but can be on the low side of that. Yes, we really want to use through hole vias. We can use 1/2 oz copper on all 8 layers. The board is small and can easily be run on a smaller production panel to improve tolerances. So, how small a capture pad and hole can be done in a production environment, reliably? Need to get this nailed down today. Barbara Burcham, C.I.D. pcb Trace Design 281-341-7539 Wk/Hm 713-249-7718 Cell [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------