Hi Dean, Better modulus of elesticity has nothing to do with it, it is the column height. Pb90 is used for its higher Liquidus temperature which allows it to be soldered with eutectic SnPb without melting and collapsing. Werner -----Original Message----- From: Stadem, Richard D. <[log in to unmask]> To: [log in to unmask] Sent: Tue, Aug 11, 2009 5:56 pm Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING Yes. The alumina oxide (ceramic) body dissipates heat better, but the delta CTE between same body and FR-4 board types is much greater, thus the use of Pb90 columns (better modulus of elasticity). -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Sent: Tuesday, August 11, 2009 4:49 PM To: [log in to unmask] Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING As far as I understand, they have two main benefits: well defined and extremly good heat transportation and withstand temp changes better than anything else, is it so? ----- Original Message ----- From: "Stadem, Richard D." <[log in to unmask]> To: <[log in to unmask]>; "Inge" <[log in to unmask]> Sent: Tuesday, August 11, 2009 11:45 PM Subject: RE: [TN] HDI AND COLUMN GRID ARRAY PACKAGING Yes. The IBM PowerPC package is one example. Millions of them out there. They are very popular on Telecomm CCAs. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Sent: Tuesday, August 11, 2009 4:43 PM To: [log in to unmask] Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING IBM invented them, but did they ever use them ? Inge ----- Original Message ----- From: "David D. Hillman" <[log in to unmask]> To: <[log in to unmask]> Sent: Tuesday, August 11, 2009 11:23 PM Subject: Re: [TN] HDI AND COLUMN GRID ARRAY PACKAGING > Hi Lee - Run............ run for the hills! A Column grid array package is > like having a BGA with coplanarity problems! The CGA are not impossible to > deal with but you do need to make sure that your stencil print operation > and solder paste volume values are repeatable and consistent. Also check > to see that the CGA in the trays do not have bent columns before you > attempt to place them. Good Luck. > > Dave Hillman > Rockwell Collins > [log in to unmask] > > > > > Lee Whiteman <[log in to unmask]> > Sent by: TechNet <[log in to unmask]> > 08/11/2009 04:02 PM > Please respond to > TechNet E-Mail Forum <[log in to unmask]>; Please respond to > [log in to unmask] > > > To > [log in to unmask] > cc > > Subject > [TN] HDI AND COLUMN GRID ARRAY PACKAGING > > > > > > > We may be using column grid array packaging with ENIG finished High > Density Interconnect (HDI) boards. Are there any ground rules for using > this type of technology? > > Lee Whiteman, PMP > Senior Member Engineering Staff > L-3 Communications East > Telephone: (856) 338-3508 > FAX: (856) 338-2906 > E-Mail: [log in to unmask] > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > --------------------------------------------------- -- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listse rv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------