Who ever made doc and approved it should get shot at... seriously.  Not a Friday joke. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jeremias, Michael
Sent: Friday, July 31, 2009 12:17 PM
To: [log in to unmask]
Subject: [TN] AW: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT

Unfortunately it is not (!) a typo from me . The document  DIN EN  61191-1 contains  this  value  2,5 µm . But I am not confident, that this   is low enough for any process cases so we use  for PTH the same rule as above  as mentioned below
Sincerely 

Michael  Jeremias

-----Ursprüngliche Nachricht-----
Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Joyce Koo
Gesendet: Donnerstag, 30. Juli 2009 12:22
An: [log in to unmask]
Betreff: Re: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT

Must be a typo. Should be 0.25 micron? 10 micro-inches? 
--------------------------
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu Jul 30 04:26:14 2009
Subject: [TN] AW: [TN] FORMULA FOR DETERMINING GOLD PERCENTAGE IN A SOLDER JOINT

IEC 61191-1
chapter  6.2.2 contains  the  rules
< 1,4% Volume Au, <  3% Wt Au in the final solder interconnection 
< 2,5 µm for  PTH Wave soldering  (I am not confident, that this   is low enough for any process cases so we use  for PTH the same rule as above)

You have to take into consideration solder paste volume(stencil-thickness), wetted Au-surface, wetted Au thickness

Own investigations  show, that Au brittelness may  occure from  1,6% Vol and really will occure from 2,3% Vol. 

 



Sincerly 

Michael Jeremias   
Industrial Engineering (OPPI41)
Electronics Production
((( Defence Electronics
EADS Deutschland GmbH
89077 Ulm
Tel.: +49 (0) 7 31.3 92-5533
Fax:     +49 (0) 7 31.3 92-73 15
E-Fax: +49 (0) 7 31.3 92-20 5533
P Before printing, think about the environment ! 

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