IEC 61191-1 chapter 6.2.2 contains the rules < 1,4% Volume Au, < 3% Wt Au in the final solder interconnection < 2,5 µm for PTH Wave soldering (I am not confident, that this is low enough for any process cases so we use for PTH the same rule as above) You have to take into consideration solder paste volume(stencil-thickness), wetted Au-surface, wetted Au thickness Own investigations show, that Au brittelness may occure from 1,6% Vol and really will occure from 2,3% Vol. Sincerly Michael Jeremias Industrial Engineering (OPPI41) Electronics Production ((( Defence Electronics EADS Deutschland GmbH 89077 Ulm Tel.: +49 (0) 7 31.3 92-5533 Fax: +49 (0) 7 31.3 92-73 15 E-Fax: +49 (0) 7 31.3 92-20 5533 P Before printing, think about the environment ! mailto: [log in to unmask] EADS Deutschland GmbH Registered Office: Ottobrunn District Court of Munich HRB 107 648 Chairman of the Supervisory Board: Dr. Thomas Enders Managing Directors: Dr. Stefan Zoller (chairman), Michael Hecht This E-mail and any attachment(s) to it are for the addressee's use only. It is strictly confidential and may contain legally privileged information. No confidentiality or privilege is waived or lost by any mistransmission. If you are not the intended addressee, then please delete it from your system and notify the sender immediateley. You are hereby notified that any use, disclosure, copying or any action taken in reliance on it is strictly prohibited and may be unlawful. - Thank you. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------