I've seen this first hand. Parts that were marginal (but acceptable) in a SnPb reflow process were unacceptable in a Pb free reflow. Cross-sections showed that the termination had pretty much disappeared into solution in the solder joint and the solder was dewetting from the ceramic body of the component. Scott Post P.O.U. 1415-00M2-00P6 2151 E. Lincoln Road Kokomo, Indiana 46904-9005 765-451-2983 (Phone) 765-451-0287 (FAX) -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Glidden, Kevin Sent: Monday, July 20, 2009 3:30 PM To: [log in to unmask] Subject: Re: [TN] Leadfree compatibility of Silver Palladium terminations? Peter, One of the many items I've learned through Technet and am happy to pass on... Palladium silver finished components have no copper or nickel barrier betweem the component substrate and the finish plating, and thus the finish plating will leach into the solder joint and leave no intermettallic between the solder joint and the component body, resulting in poor solder joint reliability. This is exacerbated by the higher Pb-free reflow temperatures. Kevin Glidden -----Original Message----- From: Peter L [mailto:[log in to unmask]] Sent: Monday, July 20, 2009 1:36 PM To: [log in to unmask] Subject: [TN] Leadfree compatibility of Silver Palladium terminations? Hi, I am wondering if anyone has experienced issues with leadfree reflow soldering small discrete chips (0805) with silver palladium terminations? According to one particular manufacturer (EPCOS) they do not approve it and claim that the termination will be "damaged" under leadfree processing temperature. I am curious to know the reason behind. Thanks. http://www.epcos.com/web/generator/Web/Sections/ProductCatalog/Protectio nDevices/CeramicTransientVoltageSuppressors/PDF/CTVS__Soldering,property = Data__en.pdf;/CTVS_Soldering.pdf --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ************************************************************************ **************** Note: If the reader of this message is not the intended recipient, or an employee or agent responsible for delivering this message to the intended recipient, you are hereby notified that any dissemination, distribution or copying of this communication is strictly prohibited. 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