Lee, The op-amp was originally installed to help a differential video driver with ESD. The driver was casing the output video to get very snowy with an ESD discharge to chassis or common ground. The op-amp helped in passing the ESD failure, so, the original issue was "a". But when a new board spin was done, the QSOP package was what was designed in. But, the QSOP package didn't help a bit, it was like it was not even there. But, if the SOIC package was once again kludged in, we would pass the ESD events. But at no time did we ever damage a part. We have since found a fix, but want to know what the difference between the packages could be. Toby -----Original Message----- From: Lee Hill [mailto:[log in to unmask]] Sent: Friday, July 17, 2009 4:58 PM To: 'TechNet E-Mail Forum'; 'Toby Carrier' Subject: RE: [TN] ESD failure difference between 16-QSOP and 16-SOIC Video Buffer Hi Toby: 1) Does "failure" mean a) "stops working but will come back to life with power and/or software reset" or does it mean b) "damaged"? 2) Is this a system-level test? If it is a system-level test and 1a is true, then you have a gross system level problem such as non-repeatable shielding performance of chassis, poorly connected video cable, screws or conductive gaskets left out, etc. Less likely - perhaps inconsistent operator test method - air discharge ESD has been extensively researched and has many uncontrolled parameters which leads to poor repeatability from test to test. But 1kV versus 25kV is so huge a spread you would really have to be trying to mess up on purpose :-) Best Regards Lee SILENT 10 Northern Boulevard, Suite 1 Amherst, NH 03031 USA +1 (603) 578-1842 (v) +1 (603) 578-1843 (f) +1 (508) 341-3947 (m) [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Toby Carrier Sent: Friday, July 17, 2009 1:51 PM To: [log in to unmask] Subject: [TN] ESD failure difference between 16-QSOP and 16-SOIC Video Buffer Hi, Does anyone have an idea why a 16-SOIC Video buffer would pass ESD testing with being kludged in, compared to a 16-QSOP package of the same part actually soldered to the PCB? The SOIC part passes a Chassis and Common ground Air Gap event up to 25kV, but the QSOP part has failures on both chassis and common at 1kV and less? I would appreciate any articles or explanations that you might have. Thanks Toby Carrier Engineering Technician --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------