Hi, Does anyone have an idea why a 16-SOIC Video buffer would pass ESD testing with being kludged in, compared to a 16-QSOP package of the same part actually soldered to the PCB? The SOIC part passes a Chassis and Common ground Air Gap event up to 25kV, but the QSOP part has failures on both chassis and common at 1kV and less? I would appreciate any articles or explanations that you might have. Thanks Toby Carrier Engineering Technician --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------