Some more info on the wave soldering parameters 1. Type of flux used - Water based 2. fluxing time - Foam flux with conveyor speed 110cm/min 3. Specific gravity of flux -- 0.882 4. Type of flux application -Foam Type- KESTER 2224-25 5. Not all the holes are having the problem. The component leads are tinned on copper. 6. Solder contact time - 4 SECS 7. Flux activation temperature -- 104°C Is the parameters OK for a 2.4mm board to be wave soldered w/o any pinholes Rgds pradeep Kane, Amol (349) wrote at Thu Jul 16 18:12:44 GMT+05:30 2009: >The PCBA absorbs moisture over time if it is not stored in moisture barrier bags with a desiccant (or if it is left out for too long between manufacturing steps on the floor). When such a PCBA is subjected to a heat cycle (smt reflow, wave or rework), this moisture turns to vapor and escapes out from the PCBA, causing issues like pin/blow holes, solder splatter, PTH cracking etc. A PCBA should be treated as a MSL 2 component and its moisture exposure limited. > >On the flip side, baking is not such a preferred option for boards with surface finishes like ImmAg and ImmSn, as this results in degradation of solderability. Moisture exposure prevention is the better way to go. > >Regards, > >Amol S. Kane >Process Engineer >Harvard Custom Manufacturing, Inc. >941 Route 28 >Owego NY 13827 >Phone: 607-687-7669 Ext 349 >Fax: 607-687-9733 >[log in to unmask] >www.harvardgrp.com > > >-----Original Message----- >From: mp3 [mailto:[log in to unmask]] >Sent: Thursday, July 16, 2009 8:32 AM >To: Kane, Amol (349) >Cc: ks >Subject: Re: RE: RE: RE: [TN] Solderability > >Thanks Amol for the feedback. I will suggest the same to my customer too. But can I know how baking improves the solderability / helps in avoiding pin holes. > >Rgds > >Pradeep > >Kane, Amol (349) wrote at Thu Jul 16 17:11:21 GMT+05:30 2009: >>Pradeep, I have not seen this phenomenon with any of the SnPb boards or test vehicles that we do. In your pictures, there are two different phenomena going on. There are pin holes in the center of (some)solder joints, and there is solder pullback on some. I have seen pullback if there are no leads in the PTH or if there is no lead protrusion thru the PTH, but not pin holes. >> >>Looking at the pictures though, It is my opinion that Wave soldering the boards after a 110C bake for 8 hours will improve the soldering quality. >> >>Hope this helps. >> >>Amol S. Kane >>Process Engineer >>Harvard Custom Manufacturing, Inc. >>941 Route 28 >>Owego NY 13827 >>Phone: 607-687-7669 Ext 349 >>Fax: 607-687-9733 >>[log in to unmask] >>www.harvardgrp.com >> >>-----Original Message----- >>From: mp3 [mailto:[log in to unmask]] >>Sent: Thursday, July 16, 2009 12:18 AM >>To: Kane, Amol (349) >>Cc: mp3 >>Subject: Re: RE: RE: [TN] Solderability >> >>Dear Mr. Amol, >> >>This is normal solder. By the way, what do you think of the photographs. Did you observe any pinholes in those boards. We had wave soldered a bare board and the diameters are 1.0mm to 2.55 mm. The PCB thickness is 2.4mm. >> >>Rgds >> >>pradeep >> >> >> >>Kane, Amol (349) wrote at Wed Jul 15 20:05:15 GMT+05:30 2009: >>>Is this lead-free solder? >>> >>>Amol S. Kane >>>Process Engineer >>>Harvard Custom Manufacturing, Inc. >>>941 Route 28 >>>Owego NY 13827 >>>Phone: 607-687-7669 Ext 349 >>>Fax: 607-687-9733 >>>[log in to unmask] >>>www.harvardgrp.com >>> >>> >>>-----Original Message----- >>>From: mp3 [mailto:[log in to unmask]] >>>Sent: Wednesday, July 15, 2009 9:51 AM >>>To: Kane, Amol (349) >>>Subject: Re: RE: [TN] Solderability >>>Importance: High >>> >>>Dear Mr. Amol, >>> >>>We will get these details and revert to the forum. i had included the photographs earlier of the bare PCB which we wave soldered at a 3rd party. As per us ( we being a PCB mfr) we thought it was quite OK. But in the eyes of my customer it does not look so. I am attaching the photographs once again. Pl revert with your comments too >>> >>>rgds >>> >>>Pradeep >>> >>> >>> >>>Kane, Amol (349) wrote at Wed Jul 15 18:51:03 GMT+05:30 2009: >>>>Pradeep, have you sent your pictures to Steve for posting on the forum? I have not seen any pictures of this condition. Depending on how much moisture the board has absorbed, baking at 120C for 2 hours will be insufficient. We bake certain boards for upto 8 hours at 110C before wave to avoid solderability issues. >>>> >>>>Some comments about wave parameters:110 cm/min (3.6 ft/min) seems to be on the high side for a 2.4 mm (0.094") thick board. The PCB should be in contact with the wave for 2-4 seconds, but also be withing the flux spec for preheat. Too hot or tool cold a preheat will also cause issues. Have them check the solder contact time and flux activation temperature. Is their solder pot composition in spec? >>>> >>>>Regards, >>>>Amol >>>> >>>>-----Original Message----- >>>>From: TechNet [mailto:[log in to unmask]] On Behalf Of mp3 >>>>Sent: Wednesday, July 15, 2009 8:43 AM >>>>To: [log in to unmask] >>>>Subject: Re: [TN] Solderability >>>>Importance: High >>>> >>>>Dear Mr. Werner, >>>> >>>>The wave soldering parameters are as follows. As indicated earlier this >>>>is a 2.4mm thick board >>>> >>>>CONVEYOR SPEED -- 110 CM/MIN >>>>ZONE 1 -- 100 C >>>>ZONE 2 -- 110 C >>>>ZONE 3 -- 120 C >>>>SOLDER TEMP -- 250 c >>>> >>>>We are also trying to get the flux parameters which we feel is critical. >>>> >>>>Hope this will give more clarity. Kindly give your feedback >>>> >>>>Rgds >>>> >>>>pradeep >>>> >>>>[log in to unmask] wrote at Wed Jul 15 09:20:05 GMT+05:30 2009: >>>>>Dear Mr.Werner, >>>>> >>>>>They claim, they did bake it at 120degC for 2 hours before they were wave soldered. Will moisture affect solderability ? Can you kindly brief how. We were under the impression that it affects only the PTH reliability. >>>>> >>>>>regards >>>>> >>>>>pradeep >>>>> >>>>>Werner Engelmaier /* wrote at Wed Jul 15 01:25:30 GMT+05:30 2009: >>>>>> Hi Pradeep, >>>>>>Did they bake the moisture out of the PCBs prior to wave soldering? >>>>>>Werner >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>>-----Original Message----- >>>>>>From: mp3 <[log in to unmask]> >>>>>>To: [log in to unmask] >>>>>>Sent: Tue, Jul 14, 2009 6:50 am >>>>>>Subject: [TN] Solderability >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>>Hi, >>>>>> >>>>>>We are a PCB manufacturer and we had supplied some 2.4mm thick PCBs >>>>>>to one of our customers who has complained regarding solderability >>>>>>issue. They say there are having issues with respect to blowholes / >>>>>>pinholes after wavesoldering. We had checked for solderability on the >>>>>>coupon and had ensured that everything is acceptable prior to the >>>>>>despatch. We repeated the same after receipt of the feedback and >>>>>>found the results to be OK. To simulate it, we sent a couple of bare >>>>>>circuits to a 3rd party assembler and got it wave soldered. The hole >>>>>>diameters are 2.55mm and 1.0mm . The photographs after wavesoldering >>>>>>trials are attached. We find it to be quite OK. We feel that since >>>>>>there are no components, and since the diameter is on the higher >>>>>>side, there will be a slight depression at the centre. But the >>>>>>customer insists that the trial boards too have a problem. Can you >>>>>>give a feedback on this after checking the attached photographs. We >>>>>>were asking our customer to check on the parameters like fluxing etc. And he says all are well in control. Any inputs to understand this issue better. >>>>>> >>>>>>rgds >>>>>> >>>>>>pradeep >>>>>> >>>>>> >>>>>>--------------------------------------------------- >>>>>>Technet Mail List provided as a service by IPC using LISTSERV 15.0 To >>>>>>unsubscribe, send a message to [log in to unmask] with following text >>>>>>in the BODY (NOT the subject field): SIGNOFF Technet To temporarily >>>>>>halt or (re-start) delivery of Technet send e-mail to >>>>>>[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing >>>>>>per day of all the posts: send e-mail to >>>>>>[log in to unmask]: SET Technet Digest >>>>>>Search the archives of previous posts at: >>>>>>http://listserv.ipc.org/archives Please visit IPC web site >>>>>>http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >>>>>>information, or contact Keach Sasamori at [log in to unmask] or >>>>>>847-615-7100 ext.2815 >>>>>>----------------------------------------------------- >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>>------------------------------- >>>>>>Micropack Ltd, Bangalore, India >>>>>> >>>>>> >>>>>>--------------------------------------------------- >>>>>>Technet Mail List provided as a service by IPC using LISTSERV 15.0 To >>>>>>unsubscribe, send a message to [log in to unmask] with following text >>>>>>in the BODY (NOT the subject field): SIGNOFF Technet To temporarily >>>>>>halt or (re-start) delivery of Technet send e-mail to >>>>>>[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing >>>>>>per day of all the posts: send e-mail to >>>>>>[log in to unmask]: SET Technet Digest >>>>>>Search the archives of previous posts at: >>>>>>http://listserv.ipc.org/archives Please visit IPC web site >>>>>>http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >>>>>>information, or contact Keach Sasamori at [log in to unmask] or >>>>>>847-615-7100 ext.2815 >>>>>>----------------------------------------------------- >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>> >>>>>>--------------------------------------------------- >>>>>>Technet Mail List provided as a service by IPC using LISTSERV 15.0 To >>>>>>unsubscribe, send a message to [log in to unmask] with following text >>>>>>in the BODY (NOT the subject field): SIGNOFF Technet To temporarily >>>>>>halt or (re-start) delivery of Technet send e-mail to >>>>>>[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing >>>>>>per day of all the posts: send e-mail to [log in to unmask]: SET >>>>>>Technet Digest Search the archives of previous posts at: >>>>>>http://listserv.ipc.org/archives Please visit IPC web site >>>>>>http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional >>>>>>information, or contact Keach Sasamori at [log in to unmask] or >>>>>>847-615-7100 ext.2815 >>>>>>----------------------------------------------------- >>>>>> >>>>>> >>>>>> >>>>> >>>> >>>> >>>>------------------------------- >>>>Micropack Ltd, Bangalore, India >>>> >>>>--------------------------------------------------- >>>>Technet Mail List provided as a service by IPC using LISTSERV 15.0 To >>>>unsubscribe, send a message to [log in to unmask] with following text in >>>>the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt >>>>or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET >>>>Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the >>>>posts: send e-mail to [log in to unmask]: SET Technet Digest Search the >>>>archives of previous posts at: http://listserv.ipc.org/archives Please >>>>visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for >>>>additional information, or contact Keach Sasamori at [log in to unmask] or >>>>847-615-7100 ext.2815 >>>>----------------------------------------------------- >>>> >>>> >>>> >>>>WARNING: Export Control >>>>This document may contain technical data within the definition of the >>>>International Traffic in Arms Regulations (ITAR), and subject to the >>>>Export Control Laws of the U.S. Government. 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