John, Can you quote the chapter and verse on the IPC Standard for your comment. What is the least amount of external annular ring copper to have after the hole has been drilled. I guess to prevent hole break out. Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Kenneth Wood Sent: Wednesday, July 15, 2009 9:48 PM To: [log in to unmask] Subject: Re: [TN] Via on pad issues John, According to the IPC, the pads for an 0201 should be 16.5mils x 18mils (0.42mm x 0.46mm). This is a tad bit small to put a 10mil hole into but you could increase the size of the pad to 20mils square and put the hole in the center of it. You will however need to epoxy fill the hole to guard against solder wicking. Contact your board house for the material they use for this. Regards Ken _____________________________________ Kenneth J. Wood Saturn PCB Design, Inc. www.saturnpcb.com [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Brubacher, John (BI09) Sent: Wednesday, July 15, 2009 5:13 PM To: [log in to unmask] Subject: [TN] Via on pad issues Hello all, Does anybody have experience with using a through hole via at the edge of the pad on a 0201 component? Can this be assembled reliably or are there significant issues to overcome? Regards, John Brubacher, CID Honeywell Security & Data Collection (Video) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------